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| advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 1/16 icg series dc/dc power modules 4.5-14v input, 6a output surface mount power module icg power modules perform local voltage conversion from either a 5v or 12v bus. the ICG12006A007V utilizes a low c omponent count that results in both a low cost structure and a high level of performance. the open-frame, compact, surface mount able design features a low profile and weight as well as additional edge plated pads that allow for extremely flexible and r obust manufacturing processes. features ? size C 12.2mm x 12.2 mm x 8.5 mm (0.48 in. x 0.48 in. x 0.335 in.) ? dosa compatible footprint ? edge plated castellations for forming inspectable solder joints ? surface mountable ? maximum weight 3g (0.106 oz) ? up to 33w of output power in high ambient temperature, low airflow environments with no power derating ? positive logic on/off ? flexible output voltage sequencing ? starts with pre-biased output ? output voltage adjustment C industry standard ? outstanding transient response without the need for external loop tuning components ? constant switching frequency ? remote sense ? power good ? full, auto-recovery protection: o input under voltage o short circuit o thermal limit ? iso certified manufacturing facilities ? patent pending optional fea tures ? negative logic on/off ? no output voltage sequencing ? solder bumping for enhanced solderability on the epc footprint
advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 2/16 ordering information: product identifier package size platform input voltage output current/ power units main output voltage # of outputs safety class feature set rohs indicator i c g 12 006 a 007 v - 0 06 - r tdk innoveta 12.19 mm x 12.19 mm icg 4.5v to 14v 6 amps 0.70v to 5.5v single see option table r=rohs 6 compliant option table: feature set positive logic on/off negative logic on/off sequence lga solder bumping* epc solder bumping* product label marking 00 x x x -000 01 x x x -001 02 x x -002 03 x x -003 04 x x x -004 05 x x x -005 06 x x -006 07 x x -007 * lga solder bumping option is recommended for custom ers using the dosa standard land grid array footprint and epc soldering bumping is recommended for customers using the inspectable edge plated castellation pads product offering: code input voltage output voltage output current maximum output power efficiency ICG12006A007V 4.5v-14v 0.70v-5.5v 6a 33w 94% 3320 matrix drive, suite 100 richardson, tx 75802 phone (877) 498-0099 toll free (469) 916-4747 fax (877) 498-0143 toll free (214) 239-3101 support@tdkinnoveta.com http://www.tdkinnoveta.com/ advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 3/16 mechanical specification: dimensions are in mm [in]. unless otherwise specif ied tolerances are: x.x 0.5 [0.02], x.xx 0.25 [0.010 ] -a- a -a- a pin locations: (bottom view) dosa pins epc pins pin function pin function 1 on/off 6 trim 2 vin 7 gnd 3 gnd 8 nc 4 vout 9 seq 5 sense 10 pw good pin assignment: see ordering information for solder bumping options advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 4/16 recommended footprint (top view): for dosa standard pads for epc pads advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 5/16 absolute maximum ratings: stress in excess of absolute maximum ratings may ca use permanent damage to the device. * engineering estimate input characteristics: unless otherwise specified, specifications apply ov er all rated input voltage, resistive load, and tem perature conditions. characteristic min typ max unit notes & conditions operating input voltage 4.5 --- 14 vdc maximum input current --- --- 6.5 a vin=2.4 to vin,max; io=io,max startup delay time from application of input volta ge --- 5 --- ms vo=0 to 0.1*vo,set; on/off=on, io=io,max, tc=25?c startup delay time from on/off --- 5 --- ms vo=0 t o 0.1*vo,set; vin=vi,nom, io=io,max,tc=25?c output voltage rise time --- 4 --- ms io=io,max,tc =25?c, vo=0.1 to 0.9*vo,set input reflected ripple --- 30* --- mapp see input/output ripple measuremen t figure; bw=20 mhz input ripple rejection --- 40* --- db @ 120 hz turn on input voltage --- 4.2 --- v turn off input voltage --- 3.5 --- v *engineering estimate caution: the power modules are not internally fused . an external input line normal blow fuse with a maximum value of 10a is required, see the safety co nsiderations section of the data sheet. characteristic min max unit notes & conditions continuous input voltage -0.25 15 vdc storage temperature -55 125 ?c operating temperature range (tc) -40 115* ?c measu red at the location specified in the thermal measurement figure; maximum temperature varies with output current C see curve in the thermal performance section of the data sheet. advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 6/16 electrical data: characteristic min typ max unit notes & conditions output voltage initial setpoint -2 - +2 % vo=3.3vsetting, vin=vin,nom; io=io,max; tc = 25?c output voltage tolerance -3 - +3 % over all rated input voltage, load, and temperature conditions to end of life efficiency vo = 1.2 v vo = 1.5v vo = 1.8v vo = 3.3v vo = 5.0v --- --- --- --- --- 84 86 88 92 94 --- --- --- --- --- % % % % % vin=5v; io=io,max; tc=25?c line regulation --- 3 --- mv vin=vin,min to vin,max load regulation --- 6 --- mv io=io,min to io,max output current 0 --- 6 a output current limiting threshold --- 10 --- a vo = 0.9*vo,nom, tc advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 8/16 electrical characteristics: typical power dissipation vs. input voltage 0 0.4 0.8 1.2 1.6 2 0 1 2 3 4 5 6 output current (a) power dissipation (w) vin = 7v vin = 12v vin = 14v vin = 9v 0 0.4 0.8 1.2 1.6 2 0 1 2 3 4 5 6 output current (a) power dissipation (w) vin = 12v vin = 14v vin = 9v vin = 4.5v vo = 5v vo = 3.3v 0 0.5 1 1.5 2 0 1 2 3 4 5 6 output current (a) power dissipation (w) vin = 12v vin = 14v vin = 9v vin = 4.5v 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 1 2 3 4 5 6 output current (a) power dissipation (w) vin = 12v vin = 14v vin = 9v vin = 4.5v vo = 1.8v vo = 1.5v 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 1 2 3 4 5 6 output current (a) power dissipation (w) vin = 12v vin = 14v vin = 9v vin = 4.5v 0 0.5 1 1.5 2 0 1 2 3 4 5 6 output current (a) power dissipation (w) vin = 12v vin = 14v vin = 9v vin = 4.5v vo = 1.2v vo = 0.7v advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 9/16 electrical characteristics: vo=1.8v typical output ripple at nominal input volt age and full load at ta=25 degrees typical output short circuit current C ch3, blue vo=1.8v typical startup characteristic from on/off at light load. upper trace - output voltage, lower trace C on/of f signal vo=1.8v typical input ripple at nominal input volta ge and full load at ta=25 degrees. input capacitors 2 x 22uf c eramic vo=1.8v typical output voltage transient response t o load step from 25% to 75% of full load with output current sl ew rate of 10a/us. (cext = 1x100uf ceramic capacitor) vo=3.3v typical output voltage transient response t o load step from 0% to 50% of full load with output current sle w rate of 10a/us. (cext = 1x100uf ceramic capacitor) vert = 5a/div horz =50ms/div vert = 10mv/div horz = 2us/div ch1 = 0.5v/div ch2 = 2v/div horz = 2ms/div vert = 20mv/div horz = 2us/div ch1 = 100mv/div ch2 = 1a/div horz = 20us/div ch1 = 100mv/div ch2 = 1a/div horz = 20us/div advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 10/16 electrical characteristics (continued): 0 0.5 1 1.5 2 2 3 4 5 6 7 8 9 10 11 12 13 14 input voltage (v) output voltage (v) io_min = 0a io_mid = 3a io_max = 6a 0 1 2 3 4 2 3 4 5 6 7 8 9 10 11 12 13 14 input voltage (v) input current (a) io_min = 0a io_mid = 3a io_max = 6a vo=1.8v typical output voltage vs. input voltage characteristics vo=1.8v typical input current vs. input voltage characteristics 1.6 1.65 1.7 1.75 1.8 1.85 0 1 2 3 4 5 6 7 8 9 10 11 output current (a) output voltage (v) vin = 12v vin = 14v vin = 9v vin = 4.5v 1.76 1.78 1.8 1.82 1.84 0 1 2 3 4 5 6 output current (a) output voltage (v) vin = 12v vin = 14v vin = 9v vin = 4.5v vo=1.8v typical current limit characteristics vo=1.8v typical load regulation 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 input voltage (v) output voltage (v) upper limit lower limit output voltage versus input voltage operating range advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 11/16 thermal performance: 0 1 2 3 4 5 6 7 45 65 85 105 125 temperature (c) output current (a) nc 0.5 m/s (100 lfm) 1.0 m/s (200 lfm) tc, thermal limit 0 1 2 3 4 5 6 7 45 65 85 105 125 temperature (c) output current (a) nc 0.5 m/s (100 lfm) tc, thermal limit -vo=5.5v, vin=12v maximum output current vs. ambien t temperature at nominal input voltage for natural co nvection (60lfm) with airflow from pin 3 to pin 7. vo=3.3v, vin=12v maximum output current vs. ambient temperature at nominal input voltage for natural co nvection (60lfm) with airflow from pin 3 to pin 7. 0 1 2 3 4 5 6 7 45 65 85 105 125 temperature (c) output current (a) nc tc, thermal limit best orientation airflow temperature measurement location on pwb cu q1 vo=0.7v, vin=12v maximum output current vs. ambien t temperature at nominal input voltage for natural co nvection (60lfm) with airflow from pin 3 to pin 7. ICG12006A007V thermal measurement location C top vi ew the thermal curves provided are based upon measurem ents made in tdk innovetas experimental test setup that is described in the thermal management section. due t o the large number of variables in system design, t dk innoveta recommends that the user verify the modules therma l performance in the end application. the critical component should be thermo coupled and monitored, and should not exc eed the temperature limit specified in the derating curve above. it is critical that the thermocouple be mounted in a mann er that gives direct thermal contact or significant measurement errors may result. tdk innoveta can provide modules with a thermocouple pre-mounted to the critical componen t for system verification tests. advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 12/16 soldering information: icg surface mountable power modules are intended to be compatible with standard surface mount componen t soldering processes and either hand placed or autom atically picked and placed. the figure below shows the position for vacuum pick up. the maximum weight of the power module is 3g (0.106 oz.). improper handling or cl eaning processes can adversely affect the appearance, test ability, and reliability of the power modules. the icg product is a moisture sensitivity level 2 device. contact tdk in noveta technical support for guidance regarding pro per handling, cleaning, and soldering of tdk innovetas power mod ules. reflow soldering the icg platform is an open frame power module manu factured with smt (surface mount technology). due to the high thermal mass of the power module and sensitivi ty to heat of some smt components, extra caution sh ould be taken when reflow soldering. failure to follow the reflow soldering guidelines described below may re sult in permanent damage and/or affect performance of the power modul es. the icg power modules can be soldered using natural convection, forced convection, ir (radiant infrare d), and convection/ir reflow technologies. the module shou ld be thermally characterized in its application to develop a temperature profile. thermal couples should be mou nted to terminal 3 and terminal 6 and be monitored. the temperatures should be maintained below 260 degrees . oven temperature and conveyer belt speeds should be controlled to ensure these limits are not exceeded. in most manufacturing processes, the solder paste required to form a reliable connection can be applied with a standar d 6 mil stencil. recommended reflow profile 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 reflow time (seconds) temperature (oc) liquidus line icg power module suggested reflow-soldering profile advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 13/16 thermal management: an important part of the overall system design proc ess is thermal management; thermal design must be considered at all levels to ensure good reliability and lifetime of the final system. superior thermal des ign and the ability to operate in severe application environments are key elements of a robust, reliable power module. a finite amount of heat must be dissipated from the power module to the surrounding environment. this heat is transferred by the three modes of heat transfer: convection, conduction and radiation. w hile all three modes of heat transfer are present in eve ry application, convection is the dominant mode of hea t transfer in most applications. however, to ensure adequate cooling and proper operation, all three modes should be considered in a final system configuration. the open frame design of the power module provides an air path to individual components. this air pat h improves convection cooling to the surrounding environment, which reduces areas of heat concentration and resulting hot spots. test setup: the thermal performance data of the power module is based upon measurements obtained from a wind tunnel test with the setup shown in the wind tunnel figure. this thermal test setup replic ates the typical thermal environments encountered in mos t modern electronic systems with distributed power architectures. the electronic equipment in networking, telecom, wireless, and advanced computer systems operates in similar environments and utilizes vertically mounted pcbs or circuit car ds in cabinet racks. the power module, as shown in the figure, is mounte d on a printed circuit board (pcb) and is vertically oriented within the wind tunnel. the cross section of the airflow passage is rectangular. the spacing between the top of the module and a parallel facing pcb is kept at a constant (0.5 in). the power modules orientation with respect to the airflow direction can have a significant impact on the modules thermal performance. thermal derating : for proper application of the power module in a given thermal environment, output current derating curves are provided as a design guideline on the thermal performance section for th e power module of interest. the module temperature should be measured in the final system configuratio n to ensure proper thermal management of the power module. for thermal performance verification, the module temperature should be measured at the component indicated in the thermal measurement location figure on the thermal performance page for the power module of interest. in all conditions, t he power module should be operated below the maximum operating temperature shown on the derating curve. for improved design margins and enhanced system reliability, the power module may b e operated at temperatures below the maximum rated operating temperature . heat transfer by convection can be enhanced by increasing the airflow rate that the power module experiences. the maximum output current of the power module is a function of ambient temperature (t amb ) and airflow rate as shown in the thermal performance figures on the thermal performance page for the power module of interest. the curves in th e figures are shown for natural convection through 2 m/s (400 ft/min). the data for the natural convection condition has been collected at 0.3 m/s (60 ft/min) of airflow, which is the typical airflow generated by other heat dissipating components in many of the systems that these types of modules are used in. in the fi nal system configurations, the airflow rate for the nat ural convection condition can vary due to temperature gradients from other heat dissipating components. airflow air velocity and ambient temperature measurement location a i r f l o w 12.7 (0.50) module centerline air passage centerline adjacent pcb 76 (3.0) wind tunnel test setup figure dimensions are in millimeters and (inches). advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 14/16 operating information: over-current protection: the power modules have short circuit protection to protect the module duri ng severe overload conditions. during overload conditions, the power modules may protect themselves by entering a hiccup current limit mode. the modules will operate normally once the output current returns to the specified operating range. remote on/off: - the power modules have an internal remote on/off circuit. the user must supp ly compatible switch between the gnd pin and the on/of f pin. the maximum voltage generated by the power module at the on/off terminal is vin,max. the maximum allowable leakage current of the switch is 10ua. the switch must be capable of maintaining a low signal von/off < 0.5v while sinking 1ma. the standard on/off logic is positive logic. in th e circuit configuration shown the power module will t urn off if the external switch is on and it will be on if the switch is off and the on/off pin is pulled up to vi n by an external 20k ohm resistor. if the positive logic f eature is not being used, terminal 1 should be left open. gnd on/ off vin (+) rpullup on/off circuit for positive logic an optional negative logic is available. in the ci rcuit configuration shown the power module will turn on i f the external switch is on and it will be off if the on/off pin is pulled up to vin by an external 20k ohm resistor. if the negative logic feature is not bei ng used, terminal 1 should be left open. gnd on/ off vin (+) rpullup on/off circuit for negative logic remote sense: the power modules feature remote sense to compensate for the effect of output distribution drops. the output voltage sense range defines the maximum voltage allowed between the output power terminals and output sense terminals, and it is found on the electrical data page for the power module of interest. if the remote sense feat ure is not being used, the sense terminal should be connected to the vo terminal. the output voltage at the vo terminal can be increased by either the remote sense or the output voltage adjustment feature. the maximum voltage increase allowed is the larger of the remote sense range or the output voltage adjustment range; it is not the sum of both. as the output voltage increases d ue to the use of the remote sense, the maximum output current may need to be decreased for the power module to remain below its maximum power rating. power good: the power module features an open- drain power good signal which indicates if the outp ut voltage is being regulated. when power is applied to the module, but the output voltage is more than +/- 12% from the nominal voltage set point due to input under voltage, over temperature, over load, or loss of control the power good will be pulled to ground through a 50 ohm maximum impedance. the maximum leakage current of the power good pin is 15ua. the voltage on the power good pin should be limited to less than 5.5v in all cases. if the po wer good feature is not used, the pin should be left op en. output voltage adjustment: the output voltage of the power module may be adjusted by using an external resistor connected between the vout trim terminal and gnd terminal. if the output voltage adjustment feature is not used, trim terminal shoul d be left open. care should be taken to avoid injecting noise into the power modules trim pin. a small 0.01uf capacitor between the power modules trim pi n and gnd pin may help avoid this. advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 15/16 trim vout(+) rup gnd circuit to increase output voltage with a resistor between the trim and gnd terminals, the output voltage is adjusted up. to adjust the o utput voltage from vo,nom to vo,up the trim resistor shou ld be chosen according to the following equation: ru vref f ? ( ) voup vonom ? ( ) ? ? ? ? ? ? := ohm the values of vref and f are found in the electrica l data section for the power module of interest. the maximum power available from the power module is fixed. as the output voltage is trimmed up, the maximum output current must be decreased to maintain the maximum rated power of the module. e.g. vo = 1.8v ru 0.59 10000 ? 1.8 0.59 ? ( ) ? ? ? ? ? ? := vout (v) ru (kohm) 0.7 53.6 1.2 9.67 1.5 6.48 1.8 4.88 2.5 3.09 3.3 2.18 5.0 1.34 voltage sequencing: some icg power modules include a voltage sequence feature. the voltage sequence feature enables the user to implement various types of powe r up and power down sequencing schemes including sequential startup, ratiometric startup, and simultaneous startup. if the sequencing feature is not being used the pin should be left open or tied to v in. when the voltage sequencing feature is used the pre - bias immunity feature is disabled. to use the voltage sequence feature, the module should be set to an on state using the on/off featu re. the input voltage should be been applied and in the specified operating range for 10ms during which a 50mv voltage potential should be maintained on the sequence pin. after the 10ms interval, an analog voltage can be applied to the sequence pin and the modules output will track the applied voltage on a one to one basis until the output reaches its set point voltage. the final sequence voltage must be higher than the module set point. for sequential shut dow n, the sequence pin voltage should be lowered. the module will decrease its output voltage on a one to one basis. the voltage sequencing circuit has a brief internal response time between the voltage appearing on the sequence pin and impacting the output voltage. if necessary, the impact of the time delay can be minimized by limiting the slew rate of the voltage on the sequence pin to less than 0.5 v/ms. for additional assistance using the voltage sequencing function, please contact tdk innoveta technical support. emc considerations: tdk innoveta power modules are designed for use in a wide variety of systems a nd applications. for assistance with designing for em c compliance, please contact tdk innoveta technical support. input impedance: the source impedance of the power feeding the dc/dc converter module will interact with the dc/dc converter. to minimize the interaction, low-esr capacitors should be located at the input to the module. it is recommended that a 22uf ceramic input capacitor be placed as close as possible to the module. data is provided on the electrical characteristics page, showing the typical input rip ple voltage with two 22uf ceramic capacitors (tdk part c3225x7r1c226mt). advance data sheet: icg series C non-isolated smt p ower module ?2011 tdk innoveta inc. icg12_full_datasheet_053111.doc 5/31/2011 rev 1.1 (877) 498 - 0099 16/16 reliability: the power modules are designed using tdk innovetas stringent design guidelines for componen t derating, product qualification, and design reviews . the mtbf is calculated to be greater than 15m hours at full output power and ta = 40?c using the telcor dia sr-332 calculation method. quality: tdk innovetas product development process incorporates advanced quality planning tools such a s fmea and cpk analysis to ensure designs are robust and reliable. all products are assembled at iso certified assembly plants. input/output ripple and noise measurements: 100khz voutput cext 1 2 + 1uh 1 2 esr<0.1 battery 100khz + rload 1 2 esr<0.1 - vinput 200uf 1 2 ground plane 300uf 1 2 - the input reflected ripple is measured with a curre nt probe and oscilloscope. the ripple current is t he current through the 1uh inductor. the output ripple measurement is made approximately 9 cm (3.5 in.) from the power module using an osci lloscope and bnc socket. the capacitor cext is located about 5 cm (2 in.) from t he power module; its value varies from code to code and is found on the electrical data page for the power module of interest under the ripple & noise voltage specification in the notes & conditi ons column. safety considerations: as of the publishing date, certain safety agency approvals may have been received on the icg series and others may still be pending. check with tdk innoveta for the latest status of safety approvals on the icg product line. for safety agency approval of the system in which t he dc-dc power module is installed, the power module must be installed in compliance with the creepage a nd clearance requirements of the safety agency. to preserve maximum flexibility, the power modules are not internally fused. an external input line n ormal blow fuse with a maximum value of 10a is required b y safety agencies. a lower value fuse can be selecte d based upon the maximum dc input current and maximum inrush energy of the power module. warranty: tdk innovetas comprehensive line of power solution s includes efficient, high-density dc-dc converters. tdk innoveta offers a three-year limited warranty. complete warranty information is listed on our web site or is available upon request from tdk innoveta . information furnished by tdk innoveta is believed t o be accurate and reliable. however, tdk innoveta assumes no responsibility for its use, nor for any infringement of patents or other rights of third parties, which may result fr om its use. no license is granted by implication or otherwise under any patent or pat ent rights of tdk innoveta. tdk innoveta component s are not designed to be used in applications, such as life support systems, wherein failure or malfunction could result in inj ury or death. all sales are subject to tdk innovetas terms and conditions of s ale, which are available upon request. specificat ions are subject to change 3320 matrix drive, suite 100 richardson, tx 75802 phone (877) 498-0099 toll free (469) 916-4747 fax (877) 498-0143 toll free (214) 239-3101 support@tdkinnoveta.com http://www.tdkinnoveta.com/ |
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